Electric & Electronic Applications

Flutec® liquids exhibit a unique combination of properties that makes them extremely useful materials with which to carry out a wide range of electronics testing, heating and cooling processes.

Their properties include:
Thermally and Chemically Stable
Very high electrical resistance
No residue on evaporation
Excellent materials compatibility
Essentially non-toxic
Very low surface tension
Low viscosity
Very high chemical and electrical resistance
Colourless, odourless


Vapour Phase Soldering
Flutec® PP10 and Flutec® PP11 have been specifically developed for vapour phase soldering to condense at 25oC – 30oC above the melting point of the most commonly used solders. Because of exceptional purity and narrow boiling range, PP10 and PP11 has the advantage of being able to achieve a constant boiling point for prolonged periods without any trace decomposition. The outstanding materials-compatibility of Flutec® fluids also means increased safety and thermal stability with minimisation of corrosion. They may be used safely with all commonly used electronic materials of construction.

Gross Leak Detection
Flutec® fluids have been approved test-fluids for gross leak detection under U.S. MIL STD for a number of years. Full details are available in MIL Standards 883-1014, 750-1071 and 202-112 for which Flutec® fluids are approved products.

Liquid Burn-in Testing
Flutec® PP10 is ideal for liquid burn-in testing because of its high thermal stability, low toxicity, excellent dielectric characteristics and wide ranging compatibility.

The test requires the thermally conductive fluid to be maintained at elevated temperatures for prolonged periods. Extensive testing of Flutec® liquids at such temperatures has shown no detectable generation of toxic or corrosive products.

Thermal Shock Testing
Flutec® fluids are approved in US Mil Standards 883-1011, 750-1056 and 202-107 for thermal shock testing. Commonly encountered temperature extremes are -55oC / -65oC (PP1 or PP3) and 125oC – 200oC PP9, PP10 and PP11.

Direct Contact Cooling / Heat Transfer
Flutec® fluids allow electronic assemblies to be immersed within the fluid and the liquid to circulate in direct contact with the hot components. Heat is transferred to the liquid very efficiently because of its relatively high thermal conductivity. The hot liquid can be cooled using suitable heat exchange equipment.

In applications where energy flux is so great that conduction, convection and radiation alone are insufficient to remove the heat Flutec® fluids allow heat to be removed by evaporation. The direct contact evaporative mode of cooling typically improves heat removal ten fold over the best heat removal methods previously used.

Currently the main cooling application is for military electronics, where evaporative cooling coupled with Flutec® properties such as high electrical resistivity, non-flammability and chemical inertness, have enabled a size reduction in equipment not previously attainable. The exceptional stability of Flutec® fluids also lends them to direct cooling of power components, for example railway vehicle equipment.

Dielectic Fluids
Flutec® fluids replace the use of oil in applications requiring separation of high voltage components, they have high dielectric breakdown strength but unlike oil are not flammable. They are ‘self heating’, discharges tend to be quenched and tracking does not occur. In additional they provide cooling. Flutec® fluids have low surface tension, very low water solubility (water will float on the surface) they are non-corrosive and non-toxic.

Flutec® fluids have sufficient solubility of oils to remove traces from electronic components. Their high densities and low surface tensions make them effective for the physical removal of particulate matter by spray / jet cleaning. Alternatively Flutec® fluids can be used in conjunction with solvents such as alcohol to form the basis of a cleaning method in which the fluid acts as a heat transfer agent a non-flammable vapour blanket, reduces the flash point of the solvent and rinses off solvent residues

CVD Chamber Cleaning
Octafluoropropane is used extensively by the semiconductor industry in etch processes and chemical vapour deposition (CVD) chamber cleaning to remove dielectric film build up.

Octafluoropropane is an ideal medium, which in a plasma with oxygen, generates a variety of reactive species which breakdown chemical deposits to make volatile products which are readily removed under vacuum.

The advantage of Octafluoropropane over other similar perfluorocarbons is that with a high molecular weight (238) a small volume of product is required making it extremely economical.

Solvent for lubricant deposition
Flutec® PP1 can used for lubricant deposition. It can dissolve and deposit a variety of high performance lubricants on a range of substrates to meet the demands of HDD Media Manufacturers, Hard Disc Drive Manufacturers and assemblers and any industry where high purity is required. Flutec® PP1 is analysed to ensure absence of unwanted ions, metals and non-volatile residue.